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Thinfilm receives US support for smart labels


Thin Film Electronics (OSE: THIN.OL; OTCQX: TFECY) announced this morning that its US subsidiary  will receive $350,000 in funding through the FlexTech Alliance to create smart labels featuring next-generation sensors and Near Field Communications (NFC) capabilities. Through the project, Thinfilm plans to extend the scope and versatility of its proprietary technology and smart label platform, while maintaining alignment with established processes for high-volume label manufacturing.

FlexTech Alliance is a leading industry association focused on growth, profitability, and success throughout the manufacturing and distribution chain of flexible, printed electronics. Its R&D program supports development of a manufacturing supply chain.

FlexTech is excited about the advancements this important project will bring about in smart labels and their dynamic sensing functionality,” said Michael Ciesinski, FlexTech Alliance President and CEO. “We’re pleased to award this funding to a leader in the printed electronics industry and look forward to working closely with Thinfilm over the coming months.”

The thin, flexible smart labels produced by Thinfilm as a result of this project will incorporate one or more sensors that dynamically detect, measure, and report on a range of environmental phenomena.

Our project with FlexTech is a significant step in creating the foundation for a next-generation sensor label capable of supporting a number of critical applications,” said Erwan Le Roy, Senior Vice President & General Manager, Smart Sensors, for Thinfilm.FlexTech Alliance has been at the forefront in advancing flexible electronics from R&D to commercialization. We look forward to our work together over the next year, which will further strengthen our relationship and advance Thinfilm’s mission of making everyday objects smart.

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